Particle Adhesion: Applications and Advances

particle adhesion: applications and advances

more information about Particle Adhesion: Applications and Advances

Particle Adhesion: Applications and Advances

Editorial Reviews
Book Description
Documents the use of particle adhesion concepts in a variety of disciplines.

About the Author
David J. Quesnel holds a Bachelor of Engineering from the State University of New York at Stony Brook and a MS and PhD from Northwestern University. Dr. Quesnel is currently Professor of Mechanical Engineering and Professor of Materials Science at the University of Rochester and is a registered Professional Engineer. His research centers on the Physics controlling mechanical properties of materials with recent emphasis on particulate materials, cohesive powders and adhesion. He has authored more than 75 technical papers and holds 3 patents.
Ronald S. Rimai received his BS (physics) from Rensselaer Polytechnic Institute and his MS and PhD (physics) from the University of Chicago and is presently a principal scientist at NexPress Solutions LLC. Dr. Rimai conducts research in the areas of particle adhesion and electrophotography. He has written more than 100 papers and holds 50 patents. He has won the Society of Imaging Science and Technology's Charles Ives award for engineering excellence, was Eastman Kodak Distinguished Inventor and is a fellow of the APS and the Adhesion Society.
Louis H. Sharpe earned a BS from Virginia Polytechnic Institute and a PhD from Michigan State University, both in chemistry. Dr. Sharpe retied after 30 years at AT&T Bell Laboratories where he supervised groups in applied surface chemistry and in adhesives engineering and development. He is entering his 33rd year as founding Editor in Chief of the Journal of Adhesion. He has won the ASTM Adhesives Award, and the ASTM Award of Merit as well as the The Adhesion Society Award for Excellence in Adhesion Science, and is a Fellow of the Adhesion Society and ASTM. He was the first William C. Wake Memorial Lecturer of the Plastics and Rubber Institute of Great Britain.

Particle Adhesion: Applications and Advances,David Quesnel,David J. Quesnel,Donald S. Rimai,Louis H. Sharpe,Taylor & Francis,9056997254,Adhesion,Chemistry - General,Congresses,Engineering - General,General,Material Science,Particles,Research,Science,Science/Mathematics,Solid State Physics,Surfaces (Technology),Technology & Industrial Arts,Science / General,Technology: General Issues

Books Review:

  1. Particle-Induced X-Ray Emission Spectrometry (PIXE) (Chemical Analysis: A Series of Monographs on Analytical Chemistry and Its Applications)
  2. Phosphorus: The Carbon Copy: From Organophosphorus to Phospha-organic Chemistry
  3. Pigment Compendium: Optical Microscopy of Historical Pigments
  4. Pigment Handbook, Properties and Economics, 2nd ed. (Pigment Handbook)
  5. Polymer Crystallization : Obervations, Concepts and Interpretations (Lecture Notes in Physics)
  6. Practice of Thin Layer Chromatography
  7. Proteins at Liquid Interfaces (Studies in Interface Science)
  8. Proteome Analysis : Interpreting the Genome
  9. Sediment Flux Modeling (Environmental Science and Technology: A Wiley-Interscience Series of Texts and Monographs)
  10. Solid - Liquid Dispersions (Surfactant Science Series)

Books Review

Books Review

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